SiP System-in-Package Design and Simulation: Mentor EE Flow by Suny Li (Li Yang) PDF

By Suny Li (Li Yang)

ISBN-10: 1119045932

ISBN-13: 9781119045939

An complex reference documenting, intimately, each step of a true System-in-Package (SiP) layout flow

Written through an engineer on the innovative of SiP layout and implementation, this booklet demonstrates the right way to layout SiPs utilizing Mentor EE move. Key themes coated contain cord bonding, die stacks, hollow space, turn chip and RDL (redistribution layer), Embedded Passive, RF layout, concurrent layout, Xtreme layout, 3D real-time DRC (design rule checking), and SiP manufacture. 

Extensively illustrated all through, System in package deal layout and Simulation covers an array of problems with important problem for SiP layout and fabrication electronics engineers, in addition to SiP clients, together with:  

  • Cavity and sacked dies design
  • FlipChip and RDL design
  • Routing and coppering
  • 3D Real-Time DRC check
  • SiP simulation technology
  • Mentor SiP layout and Simulation Platform

Designed to operate both good as a reference, educational, and self-study, System in package deal layout and Simulation is an vital operating source for each SiP dressmaker, specifically those that use Mentor layout tools. 

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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide by Suny Li (Li Yang)


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